Industrialisation and Global Scaling of PIC Manufacturing
How can PIC manufacturing transition from innovation-led development to high-volume, globally competitive production?
Heterogenous Integration: From Idea to Volume
To meet the demands of next-generation optical networks, this presentation introduces LIGENTEC’s advanced heterogeneous PIC platform. We demonstrate the integration of TFLN for ultra-high-speed (>120GHz), low-voltage modulation alongside high-speed photodetectors (PD) directly onto our low-loss (dB/m) silicon nitride (SiN) waveguide core. The low-loss platform enables tunable lasers, comb lasers and excellent optical interconnect between fibers and PICs. By transitioning this complex heterogeneous process to a high-volume automotive-qualified foundry, LIGENTEC bridges the gap between high-performance prototypes and cost-effective industrial scaling for optical sensing, communication, and computing markets.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
To Be Confirmed
Abstract for this presentation is being finalised.
Scaling photonic interconnects for next-generation cloud infrastructure
This session will explore how photonic interconnect technology can be engineered to meet the escalating bandwidth and efficiency demands of next-generation cloud infrastructure. It will consider the manufacturing and integration challenges involved in moving from prototype to volume production, and what this means for data centre architectures at scale.
From Lab to Fab: Scaling Photonic Test from Characterization to Production
As photonic integrated circuits move from R&D into higher-volume manufacturing, test strategies must evolve without sacrificing measurement quality, correlation, or flexibility. This session explores how a modular, software-connected test architecture can bridge characterization and production by integrating electrical and optical measurements with automated probing, device handling, and manufacturing workflows. Through practical examples, we’ll examine how reusing test methods, instrumentation, and data across the product lifecycle can accelerate production bring-up, improve correlation between engineering and manufacturing, and reduce the cost and complexity of scaling photonic test.
From Novel Material to Foundry Process: Scaling Electro-Optic Polymer Modulators for High-Volume Silicon Photonics
Electro-optic polymers offer faster modulation at lower power, but commercial adoption depends on how well they fit existing foundry flows. We will share how our backend-of-line process and process design kits, now available on GlobalFoundries and SilTerra silicon photonics platforms, are moving polymer modulators from development towards high-volume production for applications such as 400G co-packaged optics.
Data Before Volume: What PIC Manufacturers Can Learn from Data-Driven Semiconductor Fabs
Moving PICs into high-volume production depends as much on data as on process, with test, metrology and equipment data needing to be accessible, trusted and analysable across the fab. Drawing on our work building data platforms and self-service analytics for semiconductor manufacturers, we will show how a well-governed data foundation speeds up root cause analysis, supports predictive maintenance and gives PIC manufacturers a solid basis for scaling AI in production.
In-line 3D AFM for waveguide process control: from sidewall roughness to propagation loss
Sidewall roughness is a leading contributor to propagation loss in silicon photonic waveguides, yet it is difficult to measure directly with top-down SEM. Drawing on work with imec, this talk will show how in-line 3D AFM measures waveguide critical dimensions, sidewall angle and roughness across the wafer, and how those measurements correlate with optical loss to support tighter process control in high-volume PIC manufacturing.
Trimming for yield: post-fabrication correction as a route to volume PIC manufacturing
Fabrication variation remains one of the biggest barriers to high-yield PIC production, with resonant devices especially sensitive to nanometre-scale deviations. We’ll show how combining electron beam lithography with focused ion beam trimming allows photonic devices to be corrected after fabrication, and discuss where this approach fits within a scalable, high-volume PIC manufacturing flow.