Two days, five themes, over 30 inspiring presentations

Presentations are grouped into five key themes which collectively provide complete coverage of the PIC industry.

The PIC International team are currently in the process of securing the leading industry insiders to present at PIC International 2018.

If you are interested in speaking at PIC International 2018, please contact or call +44 (0)24 76718970.

2017 Conference Agenda

Day 1 - Tuesday 7th March 2017
Start Finish Speaker Presentation Title
08:00 08:50 REGISTRATION - Including tea/coffee
08:50 09:00 HOUSEKEEPING - Michael Lebby, Conference Chair

Supporting data centre growth

09:00 09:25 Richard Pitwon, Seagate Technology
Opportunities for data centre optical interconnects
09:25 09:45 Bert Jan Offrein, IBM Scalable integration concepts to drive down the cost of data centre photonics
09:45 10:05 Robert Blum, Intel Corporation Silicon photonics and the future of optical connectivity in the data centre
10:05 10:25 James Regan, EFFECT Photonics InP as a platform for photonic integration
10:25 10:45 Henk Bulthuis, Kaiam Corporation Perspectives on hybrid integration as a rapid and flexible route to upgrading today's datacentres
10:45 11:05 Jörg-Peter Elbers, ADVA Optical Networking Silicon photonics for inter-data centre interconnects
11:05 11:35 COFFEE BREAK

New markets: sensing, medical

11:35 12:00 Liesbet Lagae, imec
SiN biophotonic IC’s for life sciences - a trillion dollar opportunity?
12:00 12:20 Pim Kat, Technobis group Extreme fibre sensing: PIC opportunities beyond datacoms and telecoms
12:20 12:40 Iain McKenzie, European Space Agency PICs: The Final Frontier
12:40 13:00 Ewit Roos, PhotonDelta Why European Photonics is undervalued and a fast-track plan of how to change it
13:00 14:00 LUNCH BREAK

Optimising PIC design, manufacturing and packaging  - Sponsored By

14:00 14:25 Peter O'Brien, Tyndall National Institute Overcoming packaging hurdles for PIC devices
14:25 14:45 Pieter Dumon, Luceda Photonics Lean PIC design for innovators: a reality check
14:45 15:05 Ignazio Piacentini, ficonTEC Service GmbH Testing as part of the manufacturing chain: photonics wafers, singulated dies, and fully packaged devices
15:05 15:25 Ronald Broeke, BRIGHT Photonics Open source PIC design
15:25 15:45 Scott Jordan, Physik Instrumente Recent advances in industrial photonic alignment automation: An emerging enabler for test and packaging economics
15:45 16:05 AFTERNOON TEA
16:05 16:25 William Ring, POET Technologies Realizing gains in energy efficiency, component cost and size-reduction through photonic integrated solutions
16:25 16:45 André Richter, VPIphotonics Advances in layout-aware schematic-driven design automation for integrated photonics and optoelectronics
16:45 17:05 Ian Dennison, Cadence Design Systems Providing mainstream design flow for PICs
17:05 17:25 Twan Korthorst, PhoeniX Software Research-centric to Product-centric
17:25 17:45 Peter de Dobbelaere, Luxtera The design and processing of advanced transceiver integrated circuits
17:45 17:55 CLOSING REMARKS - Michael Lebby, Conference Chair
17:55 18:15 PIC AWARDS

Day 2 - Wednesday 8th March 2017
Start Finish Speaker Presentation Title
08:00 08:50 REGISTRATION - Including tea/coffee
08:50 09:00 HOUSEKEEPING - Michael Lebby, Conference Chair

PIC Platforms

09:00 09:25 Graham Reed, University of Southampton
Ion implantation of Ge into silicon to form photonics devices
09:25 09:45 Ruth Houbertz, Multiphoton Optics Closing the gap – High-precision 3D printing speeds up
09:45 10:05 Zhihong Huang, Hewlett Packard Enterprise Silicon photonics as a pic platform for next generation datacentre architectures
10:05 10:25 Roel Baets, Ghent University Silicon photonics beyond transceivers
10:25 10:55 COFFEE BREAK
10:55 11:15 Timo Aalto, VTT Technical Research Centre of Finland Thick-SOI for PICs and I/O coupling
11:15 11:35 Dimitris Tsiokos, Aristotle University of Thessaloniki CMOS compatible plasmo-photonics for mass-manufactured, powerful PICs
11:35 11:55 Michael Geiselmann, LIGENTEC Applications for thick film silicon nitride integrated circuits
11:55 12:15 Arne Leinse, LioniX International TriPleX™: The low loss industrial silicon nitride waveguide platform. Applications from VIS to IR.
12:15 12:35 Martin Schell, Fraunhofer HHI Is Plastic Fantastic? Learnings from Polymer Hybrid and InP monolithic Integration
12:35 13:35 LUNCH BREAK

Leveraging PICs in long-haul and metro networks

13:35 14:00 Eric Loos, Belgacom ICS and Geoff Bennett, Infinera
An in-depth look at the deployment of PIC technology in long haul networks and a perspective on future applications
14:00 14:20 Vladimir G. Kozlov, LightCounting Market Research
The impact of integrated photonics on the optical communications market
14:20 14:40 Mehrdad Ziari, Infinera Large scale coherent PICs in optical networks
14:40 15:00 Martin Guy, Ciena Corporation Strategies for photonic integration for metro and long-haul networks
15:00 15:20 Tom Williams, Acacia Communications Putting silicon photonics to work on metro and long haul applications
15:20 15:40 Michael Wale, Oclaro PIC-enabled telecommunications and data centre interconnects: state of the art and future prospects
15:40 15:50 CLOSING REMARKS - Michael Lebby, Conference Chair

Please Note: PIC International reserves the right to make any necessary changes to this agenda. Every effort will be made to keep presentations and speakers as represented. However, unforeseen circumstances may result in the substitution of a presentation topic or speaker. PIC International reserves the right to use photographs of any attendee for future promotions.

Delegate places are limited, so make sure you register today.