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PIC International 2017

Surpassing expectations - again! Over 550 delegates and 50 sponsors.

Brussels proves a great venue as more than 550 attend the co-located PIC International, CS International and IoT International Conferences.

Conference Chair, Michael Lebby gives his thoughts on the 2017 PIC conference.

"This was the 2nd annual PIC International Conference, and again like in 2016, it surpassed everybody's expectations, not only from the organiser’s perspective, but from the attendees, and my perspective as chairman of the conference. We had for the first time the annual PIC awards which were awarded in six categories at the end of Day 1. With over 50 nominations and 6,000 votes, the industry decided their winners.

This year, there were over 550 delegates attending two days of jam-packed (and yes we had to bring in more chairs as there was standing room only) sessions on photonic integrated circuits (PICs) that spanned the whole value chain from wafers/materials, to devices, to modules, to systems, and finally to service providers, and in particular datacentres. Like last year, the atmosphere was at times electric.

In addition to incumbent PIC technologies such as InP and GaAs, we heard updates on Silicon Photonics (SiP), Polymer Photonics (PP), as well as a new category, Dielectric Photonics (DP).

Global sized optical network system companies gave very clear expectations of the need for PIC based technologies, while transceiver and module manufacturers, both international as well as start-ups presented the latest results in a field that is one of the most dynamic in the industry.

Technical areas addressed not only PIC technology choices: InP, Silicon photonics, polymer photonics, dielectric photonics, but explored scalability both to increase performance to 50 Gbps and 100 Gbps line rates for 400 Gbps transceivers, as well as decreased cost through more efficient PIC designs, packaging, and manufacturability. New issues of designing PICs with simple packaging, athermal designs, fully electronic and photonics integration at the device level, and the use of electronic microwave/RF techniques were discussed, as well as addressing photonics design tool kits, foundries, and open source software.

One of the most exciting sessions involved the improvements in PIC infrastructure for designing and manufacturing robust and reliable PICs using software tools for modeling, simulation, and production. This was supported by many PIC talks that addressed PDKs and other metrics needed to quickly grow PIC markets. Another new and innovative area were the talks on medical, life sciences and bio-photonics and how PICs based technologies can enable new products that are more miniature, low power, and high performance, which is becoming especially important for hand-held battery powered diagnosis and health monitoring products.

These speakers showed that the result of designing PICs for the popular verticals of telecommunications and data communications, the solutions could easily be applied to medical, measurement, automotive, and other industrial applications for PICs. Perhaps by next year’s PIC conference we will see the first products emerge in these new market segments. The good news is that some of these opportunities will be high volume and will promote more aggressive pricing strategies.

As Chairman, I reviewed all the speakers’ presentations at the end of each day. Not an easy assignment given the excellent results of many of the speakers. Clearly, the impact for the PIC technology is exciting and not expected to wane in coming years, with some presentations showing that PICs are forecasted to grow to over $20BUSD by 2025. Although InP is the incumbent technology today, other technologies such as silicon photonics, polymer photonics, and dielectric photonics were seen to be all symbiotic with each other as the PIC based segment in the marketplace grows over the next decade.

I look forward to an equally exciting 2018 PIC International Conference to follow this one in Brussels, Belgium."


Platinum Sponsors


Lanyard


Portfolio


Wi-Fi


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Supported By

Image gallery PIC International 2017




Agenda 2017

Day 1 - Tuesday 7th March 2017
Start Finish Speaker Presentation Title
08:00 08:50 REGISTRATION - Including tea/coffee
08:50 09:00 HOUSEKEEPING - Michael Lebby, Conference Chair

Supporting data centre growth

09:00 09:25 Richard Pitwon, Seagate Technology
Keynote
Opportunities for data centre optical interconnects
09:25 09:45 Bert Jan Offrein, IBM Scalable integration concepts to drive down the cost of data centre photonics
09:45 10:05 Robert Blum, Intel Corporation Silicon photonics and the future of optical connectivity in the data centre
10:05 10:25 James Regan, EFFECT Photonics InP as a platform for photonic integration
10:25 10:45 Henk Bulthuis, Kaiam Corporation Perspectives on hybrid integration as a rapid and flexible route to upgrading today's datacentres
10:45 11:05 Jörg-Peter Elbers, ADVA Optical Networking Silicon photonics for inter-data centre interconnects
11:05 11:35 COFFEE BREAK

New markets: sensing, medical

11:35 12:00 Liesbet Lagae, imec
Keynote
SiN biophotonic IC’s for life sciences - a trillion dollar opportunity?
12:00 12:20 Pim Kat, Technobis group Extreme fibre sensing: PIC opportunities beyond datacoms and telecoms
12:20 12:40 Iain McKenzie, European Space Agency PICs: The Final Frontier
12:40 13:00 Ewit Roos, PhotonDelta Why European Photonics is undervalued and a fast-track plan of how to change it
13:00 14:00 LUNCH BREAK

Optimising PIC design, manufacturing and packaging  - Sponsored By

14:00 14:25 Peter O'Brien, Tyndall National Institute Overcoming packaging hurdles for PIC devices
14:25 14:45 Pieter Dumon, Luceda Photonics Lean PIC design for innovators: a reality check
14:45 15:05 Ignazio Piacentini, ficonTEC Service GmbH Testing as part of the manufacturing chain: photonics wafers, singulated dies, and fully packaged devices
15:05 15:25 Ronald Broeke, BRIGHT Photonics Open source PIC design
15:25 15:45 Scott Jordan, Physik Instrumente Recent advances in industrial photonic alignment automation: An emerging enabler for test and packaging economics
15:45 16:05 AFTERNOON TEA
16:05 16:25 William Ring, POET Technologies Realizing gains in energy efficiency, component cost and size-reduction through photonic integrated solutions
16:25 16:45 André Richter, VPIphotonics Advances in layout-aware schematic-driven design automation for integrated photonics and optoelectronics
16:45 17:05 Ian Dennison, Cadence Design Systems Providing mainstream design flow for PICs
17:05 17:25 Twan Korthorst, PhoeniX Software Research-centric to Product-centric
17:25 17:45 Peter de Dobbelaere, Luxtera The design and processing of advanced transceiver integrated circuits
17:45 17:55 CLOSING REMARKS - Michael Lebby, Conference Chair
17:55 18:15 PIC AWARDS
18:15 Late NETWORKING BUFFET AND DRINKS



Day 2 - Wednesday 8th March 2017
Start Finish Speaker Presentation Title
08:00 08:50 REGISTRATION - Including tea/coffee
08:50 09:00 HOUSEKEEPING - Michael Lebby, Conference Chair

PIC Platforms

09:00 09:25 Graham Reed, University of Southampton
Keynote
Ion implantation of Ge into silicon to form photonics devices
09:25 09:45 Ruth Houbertz, Multiphoton Optics Closing the gap – High-precision 3D printing speeds up
09:45 10:05 Zhihong Huang, Hewlett Packard Enterprise Silicon photonics as a pic platform for next generation datacentre architectures
10:05 10:25 Roel Baets, Ghent University Silicon photonics beyond transceivers
10:25 10:55 COFFEE BREAK
10:55 11:15 Timo Aalto, VTT Technical Research Centre of Finland Thick-SOI for PICs and I/O coupling
11:15 11:35 Dimitris Tsiokos, Aristotle University of Thessaloniki CMOS compatible plasmo-photonics for mass-manufactured, powerful PICs
11:35 11:55 Michael Geiselmann, LIGENTEC Applications for thick film silicon nitride integrated circuits
11:55 12:15 Arne Leinse, LioniX International TriPleX™: The low loss industrial silicon nitride waveguide platform. Applications from VIS to IR.
12:15 12:35 Martin Schell, Fraunhofer HHI Is Plastic Fantastic? Learnings from Polymer Hybrid and InP monolithic Integration
12:35 13:35 LUNCH BREAK

Leveraging PICs in long-haul and metro networks

13:35 14:00 Eric Loos, Belgacom ICS and Geoff Bennett, Infinera
Keynote
An in-depth look at the deployment of PIC technology in long haul networks and a perspective on future applications
14:00 14:20 Vladimir G. Kozlov, LightCounting Market Research
Analyst
The impact of integrated photonics on the optical communications market
14:20 14:40 Mehrdad Ziari, Infinera Large scale coherent PICs in optical networks
14:40 15:00 Martin Guy, Ciena Corporation Strategies for photonic integration for metro and long-haul networks
15:00 15:20 Tom Williams, Acacia Communications Putting silicon photonics to work on metro and long haul applications
15:20 15:40 Michael Wale, Oclaro PIC-enabled telecommunications and data centre interconnects: state of the art and future prospects
15:40 15:50 CLOSING REMARKS - Michael Lebby, Conference Chair

Register
Delegate places are limited, so make sure you register today.