AIO Core, a spin-out from PETRA and established in April 2017 in Tokyo, is fabless company to provide optical transceivers based on silicon photonics technology. Their leading-edge product, named "Optical I/O Core" is the first product from AIO Core, is the chip scale optical transceiver. 100Gbps(25Gbps×4ch) optical input and output interfaces are built in size of 5mm by 5mm and high temperature operation over 85℃ is also applicable. Optical I/O cores lead us to realize many optical interconnection applications such as industrial and consumer application in addition to HPC or DC. AIO Core will create new valuable interconnection with our partners and customers in region across the world.
In the past four decades, PI (Physik Instrumente) with headquarters in Karlsruhe, Germany has become the leading manufacturer of micro- and nanopositioning systems with accuracies from (sub-)micrometer down to the nanometer range. With four company sites in Germany and fifteen sales and service offices abroad, the privately managed company operates globally. More than 850 highly qualified employees around the world enable the PI Group to meet almost any requirement in the field of innovative precision positioning technology. All key technologies are developed in-house. This allows the company to control every step of the process, from design right down to shipment: precision mechanics and electronics as well as position sensors.
Mentor, a Siemens Business (represented by EDA Solutions), is a world leader in electronic hardware and software design solutions for the world’s most successful electronic, semiconductor, and systems companies.
A global expert in electrical power and advanced materials, Mersen designs innovative solutions to address its clients’ specific needs and enable them to optimize their manufacturing performance. Mersen’s 6,400 employees operating in 35 countries provide purpose-designed solutions bespoke to customer requirements anywhere on the planet. Our material expertise on graphite, carbon/carbon composite, carbon insulation, flexible graphite and silicon carbide (SiC) gives us the possibility to engineer enhanced solutions for demanding applications such as industrial processes, aerospace, solar PV, semicon, LEDs, as well as in energy storage.
Multiphoton Optics offers a 3D Printing Platform (LithoProf3D) and Software (LithoSoft3D) for high-precision 3D printing of arbitrarily shaped structures of a large variety of materials. The equipment allows additive and subtractive processes. Our technology supports scalable processes for different applications and products. The high-precision fabrication of 3D optical interconnects to integrate optical links on-chip, on-board, or in photonic integrated circuits to create sophisticated optical packages is compatible to standard processes in electronic manufacturing and saves app. 80 % of process steps. This enables to significantly reduce energy consumption in production and to save other resources in production and in end-use, for example in high performance computers. We also provide Prototyping & Engineering Services for aspheric or free-form microoptics, and biomedical products, such as scaffolds for tissue engineering, microfluidic cells, or drug delivery structures.
Nanoscribe is a worldwide leader in high-precision additive manufacturing on the nano-, micro- and mesoscale. With more than 10 years on the market, we supply 3D printers, resins and related process solutions. The 3D printers "Photonic Professional GT" are the world's highest resolution systems for three-dimensional nano- and microfabrication. They are designed for high-speed fabrication into photosensitive materials. Our customers are pioneers and innovation leaders in science and industry, e.g. producing DOEs, micro-optics as well as photonic wire bonds for ICT. More than 1,000 users in 30 countries rely on our products and services.
Optoscribe has developed a fully integrated platform of optical and photonic capabilities combining a range of 3D waveguides, precise alignment features for fiber interconnects and micro-optic components. The Company uses its innovative laser direct write technology to manufacture glass-based integrated photonic components for the telecommunications and data communication markets. The technology directly writes optical waveguide circuits and micromachined structures within a block of glass. Integrating these micro-structures provides new levels of fiber coupling and significant relaxation of optical transceiver design constraints in terms of layout, assembly and packaging. The Company, formed in 2010, is located in Livingston, Scotland and currently has around 30 employees.
PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line. PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging. The Pilot Line Gateway Office is PIXAPP's the easy-access interface for external users. PIXAPP gives companies an easy-access route to transferring R&D results to the market.
Photon Design was started in 1992 and supplies a wide range of innovative photonics CAD tools to most of the World's leading photonics companies, universities and government research labs, with customers in 35 countries around the world. Our CAD products include tools for both passive and active (semiconductor) optical components and optical circuit modelling. The company has a team of the brightest people in photonics modelling, developing original and innovative solutions for tomorrow's photonics design projects, saving designers significant time and money.
Rockley’s core technology platform was developed with a total focus on high volume manufacture of highly integrated optical/electronic devices. Rockley’s large waveguide photonics platform offers multiple benefits over conventional solutions. These benefits include higher density waveguide circuit design, better manufacturing tolerance,superior optical power handling, and a more efficient interface from the photonics IC to the physical domain. Rockley Photonics’ technology simplifies the manufacturing, assembly, and test process while maximising the power efficiency of the optical system.
SUSS MicroOptics SA was formed in 1999 with the remit to supply its parent SUSS MicroTec AG with micro-optical elements for their lithography equipment. As the market for micro-optics grew, SUSS MicroOptics expanded to meet the new and diverse requirements, developing its product portfolio and expertise to become one of the leading producers of precision refractive and diffractive micro-optics in the world. SUSS MicroOptics is recognized by Carl Zeiss SMT GmbH as a Preferred Supplier and first became ISO 9001 certified in 2008. In 2013 it moved to its current premises, complete with state-of-the-art cleanroom, from where it continues to deliver excellence to its international customer base. SUSS MicroOptics is a wholly owned subsidiary of SUSS MicroTec SE, a leading supplier of products and solutions for backend lithography, wafer bonding and photomask processing.
Synopsys is driving the photonic integrated circuit (PIC) revolution with design automation solutions for applications ranging from data communications to sensors and biomedical devices. Synopsys’ PIC Design Suite – including the RSoft™ OptSim™ Circuit and OptoDesigner tools – offers a seamless PIC design flow from concept to manufacturable design, as well as access to a single, world-class support channel.
Teem Photonics offers innovative solutions for silicon-photonics chip-to-fibre optical interfacing based on its flexible, competitive, reliable, scalable and cost-effective ioNext platform. This ion-exchange technology has been developed for more than 20 years for the manufacturing of optical integrated circuits on glass wafers. We also propose standard and advanced PIC (splitters, couplers, Taps, duplexers, polarizers, interferometers) as well as skills in optical design, fibre-to-chip assembly and packaging.
Teem provides worldwide clients for many applications in Telecom, Bio-medical, Transport, Energy, Defence, Science,… Let us know your need and we will show how a little piece of glass can change everything.
Thorlabs, a vertically integrated photonics products manufacturer, was founded in 1989 to serve the laser and electro-optics research market. Thorlabs has extended its core competencies in an effort to play an ever increasing role serving the Photonics Industry at the research end, as well as the industrial, life science, medical, and defense segments. The organization’s diverse manufacturing assets include semiconductor fabrication of laser diodes, optical amplifiers, lithium niobate modulators, quantum cascade/interband cascade lasers, and VCSEL lasers; fiber towers for drawing both silica and fluoride glass optical fibers; MBE/MOCVD epitaxial wafer growth reactors; extensive glass and metal fabrication facilities; advanced thin film deposition capabilities; and optomechanical and optoelectronic shops.
VTT Technical Research Centre of Finland Ltd. is a non-profit R&D company that covers the whole value-chain from devices to systems in various application and technology fields. VTT offers design, wafer-level processing, hybrid integration, packaging and testing services for photonic integrated circuits. In silicon photonics VTT is one of the pioneers globally and leading the development of micron-scale silicon waveguide technology. Benefits of VTT's 3 and 12 µm SOI technlogies include low loss, small polarisation dependency, ultra-wide bandwidth and ultra-small footprint. In addition to R&D VTT can offer small and medium volume manufacturing services.
MIRPHAB is an all-services Pilot Line for the fabrication of Mid-Infrared sensors, a single access point to the best technology, facilities and expertise provided by a consortium of leading companies in the field of photonics. MIRPHAB provides services for device design and fabrication from chip processing on wafer level to packaging and testing. MIRPHAB reduces the barriers to introduce your chemical sensor into the market by granting your proposal up 230k€
ASM AMICRA Microtechnologies GmbH is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (+/- 0.3µm@3sigma). Our equipment offering supports Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 600 x 550mm bonding area, quantitative tilt calibration system, etc. Our Market focus includes: PIC/SiPhotonics, Automotive Sensors LiDAR, Optoelectronics, AOC, FanOut. Other products we offer: High Speed Wafer Inking and Inspection, High Speed Dispense System, and Custom Solutions
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com
Applied Nanotools (ANT) is a provider of photonics products/services for x-ray and infrared wavelengths. The NanoSOI process is a cost-effective avenue for the rapid prototyping of photonic integrated circuits on silicon-on-insulator substrates. The process uses a high-throughput 100 keV electron-beam lithography process to pattern silicon structures down to 60 nm with excellent repeatability and accuracy. Fabrication is performed in a multi-project wafer (MPW) capacity or in a dedicated run that is tailored to your specific needs. We offer various process options such as multiple etch levels, edge couplers, heaters for thermo-optic devices, selective doping, suspended devices and custom cladding.
Bay Photonics are experts in Photonic Integrated Circuit (PIC) packaging for proof of concept, prototyping and production, using their extensive knowledge of semiconductor and laser/led assembly for design, development, design for manufacture (DFM), production method and test (DFT). They offer both design consultancy and bespoke assembly/packaging services to achieve the customer’s goal. The Team can assist with New Product Introduction (NPI) engineering as product line volume grows and offer services to help transfer to manufacturing facilities within the UK, Europe or to both offshore Contract Electronic Manufacturers and company subsidiaries. The founders and Senior Engineers all have in depth experience with fibre optic assembly and die packaging from their careers with STC, Nortel and Bookham. The equipment list continues to expand to meet new and future customer demands and currently includes manual die bonding, manual and auto gold and aluminium wire bonding , various optical alignment capabilities (including a 6 axis auto align stage, auto/semi-auto die bonding and hermetic seam sealing capability. Located in the South West of the UK, they have their main office at the Brixham Laboratory complex which also houses other members of the Torbay Photonics Cluster ecosystem.
Brolis Semiconductors is an infrared laser diode maker in the spectral range from 800 nm - 3000 nm based on GaAs, InP and GaSb. The company develops a range of light sources from SLDs to high-power multi-watt singel emitters and laser bars for defence, medical, sensing and research applications.
CIOE(China International Optoelectronic Exposition) is one of the world’s most influential exhibitions in the optoelectronic field covering the entire optoelectronic ecosystem including optical communications, data center, infrared applications, laser technologies, precision optics, lens and camera modules, machine vision, optoelectronic sensors and photonics innovations. It’s been known and proved as an effective and resultful platform or optoelectronic companies to open their market in China. It also serves as the one-stop sourcing platform for professionals to purchase, to get insights of the markets and to exchange technical communications from the following industries: optical communication, information processing & storage, advanced manufacturing, consumer electronics, semiconductor manufacturing / processing, defense & security, sensing & measurement, energy, medical and lighting & display.
CORNERSTONE is a fabrication capability that can provide competitive prices for both active and passive silicon photonic devices. The CORNERSTONE team, headed up by Professor Graham Reed at the University of Southampton, aims to offer up to 6 passive calls and 2 active calls per year via an MPW service. With a track record of world-leading results, and supported by some of the world’s best academic fabrication facilities for microfabrication and high-spec nanofabrication, CORNERSTONE is also open to dedicated fabrication runs at affordable prices. Through the use of advanced projection lithography, CORNERSTONE can offer both an industry compatible fabrication capability, and design flexibility and freedom, essential for research and prototyping purposes, which may not be accessible at other foundries.
Cordon Electronics Italia is a subsidiary of CORDON ELECTRONICS Group, located in Milan area, Italy. We design, develop and manufacture components and subsystems in Microwave, Photonics and Microwave-Photonics technologies for Aerospace, Defense, Telecom and Industrial markets. Cordon Electronics Italia aims to optimize the manufacturing process, supporting clients on their prototyping and pre-series activities for new products, and to perform design to cost effective programs. Our knowledge on Silicon Photonics, Indium Phosphide and hybrid integration technologies for photonic integration and packaging, makes us the reliable partner for SMEs and large companies looking for Contract Manufacturing and product development of photonic components and modules.
Dassault Systèmes, the 3DEXPERIENCE Company, provides business and people with virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault Systèmes’ collaborative solutions foster social innovation, expanding possibilities for the virtual world to improve the real world. The group brings value to over 220,000 customers of all sizes, in all industries, in more than 140 countries.
EXFO pioneers smarter network test, monitoring and analytics solutions for the world’s leading CSPs, NEMs and webscale companies. Our portfolio of test orchestration and real-time 3D analytics solutions turns complex into simple and delivers business-critical insights from the network, service and subscriber dimensions. EXFO.com
Electro Optics is Europe's original photonics title and multi-platform resource for anyone involved in the photonics industry. Readers have access to the latest technological developments, trends and opinions; independent, in-depth editorial content; and informed commentary and analysis. Electro Optics is published ten times a year in print and digital editions, and alongside two monthly newsletters, EO Newsline and EO Productline, is available at no cost to readers working or engaged in the photonics industry. Subscribe here: www.electrooptics.com/subscribe
Fibre Systems is a trusted information source for the optical communications industry, aimed at component and subsystem vendors, network equipment manufacturers, planners, installers and system integrators, and operators and end-users of fibre-optic networks worldwide. Addressing the technologies, applications, business and regulatory issues that shape the fibre-optic systems market, Fibre Systems is published quarterly in print and digital editions, and alongside a monthly newsletter, FS Newsline, is available at no cost to readers working or engaged in the optical communications industry. Subscribe here: www.fibre-systems.com/subscribe
GoPhotonics.com is a website for the Photonics Industry. It is the largest searchable database of Photonics products on the internet. GoPhotonics have developed a product search tool for the industry enabling engineers to find products from the leading manufacturers by specifications. In addition to this, it also keep users up to date with the latest Industry news, new product releases and upcoming events.
The Fondazione INPHOTEC of the Scuola Superiore Sant’Anna located in Pisa-Italy, is a no-profit legal entity created according to the Italian Law 388/2000. Its mission is to provide fabrication facilities and technology platforms for research, prototyping and production of high added-value components and circuits to academics and industrial SME. The major areas where INPHOTEC can provide innovative front-end and packaging technologies are:
Photonic integrated circuits and optoelectronics
Bio photonics and medical applications
Sensors and MEMS, MOEMS
The INPHOTEC technology center started its activity in January 2015 as a part of the TeCIP Institute of Scuola Superiore Sant’Anna and has become part of an independent Foundation on February 1st, 2018. Since its birth in 2015, it has signed contracts with major industries as well as with European public Institutions and it is currently participating in several European and national projects.
IQE is the leading global supplier of advanced semiconductor wafers with products that cover a diverse range of applications, supported by an innovative outsourced foundry services portfolio that allows the Group to provide a 'one stop shop' for the wafer needs of the world's leading semiconductor manufacturers. With a pedigree dating back more than twenty-five years, IQE offers the industry’s broadest product portfolio, with a choice of technology platforms from multiple, global manufacturing facilities across Europe, Asia and the USA. Our unparalleled experience in the production and supply of substrates and epiwafers across a number of key market areas make IQE the perfect partner for substrates and epiwafers for visible and infrared optoelectronic devices, multi-junction CPV solar cells and RF components for wireless applications.
InPulse democratizes access to industrial prototyping and pre-production of high-performance InP photonic integrated circuits (PIC). InPulse has the ambition to transform business practices from vertical integration – where design, fabrication and product development are all in-house and inaccessible to new entrants, to horizontal where fabless and lab less businesses share the same manufacturing infrastructure. InPulse provides a low entry barrier access to low and medium production volumes of InP PICs.