INTRODUCTION

The 4th PIC International conference built on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning five sectors:

2019 Themes
  • PICs Today − Datacom, Imaging and TransportPIC design, simulation and packaging: a blueprint for future success
  • PIC Innovation − EPDA, TAP & PICs Beyond Datacom
  • PICs Reimagined − Hybrids and Materials Innovation
  • PIC ROI − Show Me the Money
  • PICs Beyond 100G − Evolution and Revolution

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we strengthened the relationships between the makers and the users of photonic integrated circuits with the 4th edition of PIC International, a conference dedicated to the global industry.

Attendees at the two-day conference gained an up-to-date overview of the status of the CS industry, and had many opportunities to meet many other key players within the community.

The event was a success in every way. I was particularly happy with the setup where the conference room and commercial area were very close by. For me it was the best commercial tradeshow ever.
Erwin De Baetselier - Luceda Photonics
We were very pleased with the content and level of the conference, the level of attendees, and the networking.
Ignazio Piacentini - ficonTEC
I thought the conference was one of the best for any industry I have attended in terms of technical content, opportunities for networking, efficiency of organisation and smooth running, well done and hard to improve.