Two days, five themes, over 30 inspiring presentations

The PIC International conference has attracted industry leading experts from all the major companies involved in the photonic integrated circuit industry.

Book your place today as tickets are limited for 2019. Please contact us via info@picinternational.net or +44 (0)24 76718970 for more details.

Monday 25th March 2019
18:30-21:00
Pre-conference networking drinks reception, organised by Angel Business Communications IQE PLC and EPIC
Day 1 - Tuesday 26th March 2019
08:00
REGISTRATION - Includes Refreshments
08:50
Housekeeping by Michael Lebby
PICs Today − Datacom, Imaging and Transport

Today's primary PIC applications in data centers and telecom are foundations for new opportunities. We will explore PICS for healthcare, diagnostics, imaging/ranging and vehicle automation as well as new approaches for data transport.

09:00
Large scale PICs, integration with InP lasers and PICs across future networks and markets
Mehrdad Ziari, Infinera
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PICs Today − Datacom, Imaging and Transport

Presentation

Large scale PICs, integration with InP lasers and PICs across future networks and markets

This presentation's abstract will be available shortly.

Speaker

Mehrdad Ziari

Senior Director at Infinera


Mehrdad Ziari joined Infinera in 2002 and is currently Sr. Director of Product Development and responsible for product development and engineering of PICs, ASICs and modules. Prior to joining Infinera, he was a member of the R&D team at SDL Inc. where worked on various laser diode and optical component technologies and led InP R&D activities and development of Raman pump laser products. He has received his Bachelor of Science with Suma Cum Laude honors, MS and Ph.D. degrees in Electrical Engineering in 1986, 1987 and 1992 respectively from the University of Southern California in Los Angeles, CA. He has published over 100 papers, two book chapters and is named on over 30 patents.

09:15
Achieving high quality 100G data center PIC Integration
Katharine Schmidtke, Facebook
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PICs Today − Datacom, Imaging and Transport

Presentation

Achieving high quality 100G data center PIC Integration

This presentation's abstract will be available shortly.

Speaker

Katharine Schmidtke

Strategic Sourcing Optical Technology at Facebook

09:35
AIM Photonics’ role in developing next generations of PICs and TAP manufacturing expertise
Michael Liehr, American Institute for Manufacturing Photonics
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PICs Today − Datacom, Imaging and Transport

Presentation

AIM Photonics’ role in developing next generations of PICs and TAP manufacturing expertise

AIM Photonics is a Manufacturing USA institute whose mission is to provide cost-effective and easy-to-use access to state-of-the-art silicon photonics processing. AIM Photonics is providing access to a Multi-Project-Wafer program enabled with a highly competitive component library and offers Assembly and Packaging services starting 2019. AIM is supporting consortium projects with the intent to enable new manufacturing technology for reduced assembly cost, but is also developing custom processes in support of industry or government funded PIC products. AIM has a Si Photonics process available at SUNY Poly and an InP offering at Infinera and potential application examples will be discussed.

Speaker

Michael Liehr

CEO at American Institute for Manufacturing Photonics


Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) Photonics. Michael focuses on the creation of new AIM business opportunities, and is responsible for the effective and efficient operation of AIM’s programs including SUNY Poly’s strategic 300mm integrated photonic semiconductor and 3D packaging. He is also SUNY Polytechnic Institute’s Vice President for Research and Executive Vice President for Technology and Innovation. Prior to this assignment, he led the Global 450mm Consortium through the start-up phase as the General Manager and was an IBM Distinguished Engineer.

09:50
New VCSEL opportunities in 3D sensing and beyond
Pauline Rigby, Lightcounting
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PICs Today − Datacom, Imaging and Transport

Presentation

New VCSEL opportunities in 3D sensing and beyond

Vertical-cavity surface emitting lasers (VCSELs) have been the workhorse of datacom networks for several decades – lighting up multimode fibres at wavelengths around 850nm – but new opportunities in consumer markets require product volumes that are orders of magnitude greater - with visible effects on the revenues reported by key components vendors. Apple pioneered 3D sensors for facial recognition in smartphones and world-facing 3D sensors to enable AR/VR will be next. New opportunities for lasers in lidar systems for autonomous driving are also on the horizon.

Speaker

Pauline Rigby

Lightcounting


Pauline has 20 years’ experience writing about optical components for the telecom and datacom industries. She started as technology reporter and eventually became editor of Fibre Systems magazine and remains as a consulting editor on the title. Pauline has a degree in engineering and a doctorate in optoelectronics from the University of Oxford, where she studied the properties of photonic bandgap materials.

10:05
Device prototyping using the CORNERSTONE platform
Callum Littlejohns, Cornerstone, University of Southampton
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PICs Today − Datacom, Imaging and Transport

Presentation

Device prototyping using the CORNERSTONE platform

As the market adoption of silicon photonics technologies continues to rise, and ever more fabless companies enter the market, there is a clear need for a flexible device prototyping foundry service that retains the ability for device level innovation, and also offers a clear path for up-scaling. The CORNERSTONE platform offers a low cost multi-project-wafer (MPW) service that enables a degree of customisation, which may not be accessible at other foundries. Through the use of projection lithography, fabrication processes can be easily transferred to other foundries for mass production. Additionally, the ability to exploit high resolution e-beam lithography mimics more advanced technology nodes for certain layers, should this be deemed necessary. This talk gives an overview of the CORNERSTONE platform.

Speaker

Callum Littlejohns

Cornerstone, University of Southampton


Dr Callum Littlejohns completed his PhD in the field of Silicon Photonics at the Optoelectronics Research Centre, University of Southampton in March 2015, having previously obtained a First-Class Honours degree in Electronic Engineering at the University of Surrey. He is now part of the CORNERSTONE team in the Silicon Photonics Group at the University of Southampton, working on rapid prototyping of silicon photonics devices. He has a track record of excellence, having received multiple awards throughout his academic life, including the Information Overload category winner at the 2015 EPSRC ICT Pioneers Awards. Callum has published a book chapter, over 25 papers in peer-reviewed journals, and over 80 international conference papers, including a prestigious post-deadline paper at the 2014 IEEE Group IV Photonics conference, in the field of silicon photonics. The work completed during Callum’s PhD has been protected by two separate patents, both fully supported by the University of Southampton. He has twice served as the conference chairman at the Enlighten conference as part of the Photonex Europe exhibition.


10:20
Presentation TBC
René Penning de Vries, Photon Delta
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PICs Today − Datacom, Imaging and Transport

Presentation

Presentation TBC

This presentation's abstract will be available shortly.

Speaker

René Penning de Vries

Photon Delta


René Penning de Vries, PhD, has been employed by Royal Philips NV and subsequently NXP Semiconductors as Chief Technology Officer and as CEO of NXP Netherlands.  Since 2012 René has taken up various public sector roles with the aim of fostering of innovation.  René acts as Chairman Dutch Digital Delta (https://www.dutchdigitaldelta.nl/) , which is an initiative from the Dutch Ministry of Economical Affairs to facilitate public-private partnerships in the area of ICT.  In addition, René is chairing the Health Valley foundation (https://www.healthvalley.nl)  

that aims to accelerate innovation by bringing together expertise in healthcare and high tech or ICT.  Furthermore, René is advising the Dutch National Science Council NWO, is chairman of the board of the BOM, a regional development agency (250MEuro) and chairman of the St Maartenskliniek, a specialized clinic for posture and movement. Since early 2018, René is leading PhotonDelta, which oversees the national initiative on Integrated Photonics. 


10:35
Morning Refreshment Break
11:05
PIC differentiation, emerging markets, and common modular platforms for assembly and test.
Ignazio Piacentini, ficonTEC
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PICs Today − Datacom, Imaging and Transport

Presentation

PIC differentiation, emerging markets, and common modular platforms for assembly and test.

Differentiation in the assembly and test process requirements between photonic devices in emerging markets has consequences for automated production equipment. Modularity in the approach to system layout provides the tools for addressing these differences, where both common application-specific platforms and custom configurations become the norm. But the benefits don’t end there.

Speaker

Ignazio Piacentini

Director of Business Development at ficonTEC


Ignazio Piacentini has recently taken up the position of Director of Business Development at ficonTEC GmbH in Achim, Germany, after heading the Photonics Devices Assembly Business Unit at PI miCos GmbH (PI Group).

Previous to that, he directed ImagingLab Srl, in Lodi (Italy) an engineering / consulting company specialized in machine vision and advanced robotics. He held the position of Business Development Manager Europe for imaging and motion of National Instruments (Austin, TX) from 1999 to 2003.
He has a B.Sc. in Nuclear Engineering (Milan, Italy, 1975) and a M.Sc. degree in Digital Systems and Instrumentation (Polytechnic of Central London, UK, 1987).

Before joining the machine vision industry in the early nineties, he has spent many years working for the European Commission (Euratom) designing control and data acquisition systems for the thermonuclear fusion research community, with a long spell at the JET project (Culham Labs, UK). In more recent years he was selected as an 'external expert' consultant for ITER (a large scale thermonuclear experimental project) working on Remote Handling Control System issues, Viewing equipment, Virtual and Augmented Reality, and 3D Vision and Metrology.

He has served two consecutive mandates as a member of the Board of Directors of EMVA (European Machine Vision Association).

11:20
The future and economics of PICs and PLCs in data center applications
Henk Bulthuis, Kaiam Corporation
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PICs Today − Datacom, Imaging and Transport

Presentation

The future and economics of PICs and PLCs in data center applications

This presentation's abstract will be available shortly.

Speaker

Henk Bulthuis

Kaiam Corporation


Henk Bulthuis is Team leader of the optics design group of Kaiam Europe, formerly Gemfire Europe, Avanex, Alcatel Optronics and Kymata.

He co-founded BBV software BV and BBV design BV which were acquired by Kymata in 2000. Close to 800 mask reticles and 2000 of his PLC/PIC designs

were simulated, layed out fabricated and tested. Most of the designs were made in glass or silicon technologies. 

11:35
Panel Session How does the PIC industry deliver on the promises of size, speed, and economy with high quality?
Katharine Schmidtke, Robert Blum, Mehrdad Ziari
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Panel Session

How does the PIC industry deliver on the promises of size, speed, and economy with high quality?

PIC devices offer size, performance and energy advantages that have enabled rapid growth among optical component manufacturers while encouraging entrants offering new and novel insights. End users need high levels of consistent quality--the hallmarks of CMOS device fabrication--while process tool, assembly and test automation experts strive to support the unique requirements of PIC module TAP. Today’s PIC-based transceivers or PIC transceiver components are often assembled, packaged and tested manually. Is it possible to drive demand while the infrastructure needed to support it is still being conceived, designed and built?

Speakers

Katharine Schmidtke

Facebook

Robert Blum

Intel

Mehrdad Ziari

Infinera

12:05
Lunch Break
PIC Innovation − EPDA, TAP & PICs Beyond Datacom  - Sponsored By

Electro-photonic design automation (EPDA) paired with automated test, assembly and packaging (TAP) are essential for ensuring rapid PIC development cycles and quality control. We will explore how tools and processes will enable greater yield, reliability and sector growth

13:20
Presentation Title TBC
Martijn Heck, ePIXfab – European Silicon Photonics Alliance
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Presentation Title TBC

This presentation's abstract will be available shortly.

Speaker

Martijn Heck

ePIXfab – European Silicon Photonics Alliance

13:35
VCSELs in 3D facial recognition
David Cheskis, IQE
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

VCSELs in 3D facial recognition

VCSEL technology and manufacturing capabilities have advanced dramatically in the last several years with the adoption of high volume applications. The establishment of 6-inch GaAs VCSEL manufacturing processes has opened the door to new opportunities – and provided new challenges. This presentation will discuss VCSEL manufacturing advances that have allowed the industry to scale fabrication to meet these challenges and provide more capacity than ever before. We will also introduce new Photonic Quasi-Crystal (PQC) technology that will enable additional photonic component integration directly onto VCSEL wafers.  


Speaker

David Cheskis

IQE


David Cheskis serves as Vice President of Strategic at IQE, responsible for epitaxial products across all of IQE business units that are focused on addressing communications, connectivity and interactivity. Dr. Cheskis started the world’s first 6-inch GaAs VCSEL wafer foundry at ANADIGICS (subsequently acquired by II-VI Inc.) and is an expert in semiconductor, optoelectronics and communications technologies, products and markets.  Dr. Cheskis earned M.S. and Ph.D. degrees in Electrical Engineering from the University of California, San Diego. 


13:50
How Synopsys Is Driving the PIC Revolution with a Trusted and Scalable Design Flow
Remco Stoffer, Synopsys
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

How Synopsys Is Driving the PIC Revolution with a Trusted and Scalable Design Flow

This presentation's abstract will be available shortly.

Speaker

Remco Stoffer

Synopsys


Remco Stoffer received his MSc degree in Applied Physics and PhD degree from the University of Twente, The Netherlands, in 1997 and 2001, respectively. He previously worked in the companies Kymata Netherlands, Alcatel Optronics Netherlands, and PhoeniX Software, and as a postdoc at the University of Twente. He is currently employed by Synopsys in the Netherlands, formerly as numerical engineer and currently as product owner of the OptoDesigner product suite. He has contributed as a developer to the OptoDesigner, FieldDesigner, FlowDesigner, and MaskEngineer software packages. Furthermore, he has contributed as work package leader or senior researcher to more than ten European or Dutch research projects, and has 20 journal papers and more than 30 conference contributions to his name.

14:05
Photonics and EDA – Round Hole and Square Pegs
Tom Daspit, Mentor, a Siemens Business
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Photonics and EDA – Round Hole and Square Pegs

IC designers & tool developers have lived in an orthogonal world for 60 + years. Hundreds  of thousands of man years have been invested developing EDA tools for IC design. This investment representing 100’s of millions of lines of code. Photonics and MEMS have  changed this.  For integrated photonics to take off, commercial EDA tools are needed that can implement and physically verify curved shapes. Throughout the design flow, support is needed for coexistence of both electrical and photonic designs. Layout automation is required to enable the expected growth in the size of photonics designs.

Speaker

Tom Daspit

Mentor, a Siemens Business


Tom started his career as an intern supporting the memory designers at Harris  Semiconductor. After graduation from Clemson University he became a full custom design at Gould AMI. He continued his custom design work Wafer Scale Integration. Tom has spent the last 25 years working in various EDA applications, sales, and marketing roles. Tom is current a product manager in Mentor’s ICDS division.

14:20
Scalable PIC design: increasing yield of components, circuits and systems
James Pond, Lumerical
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Scalable PIC design: increasing yield of components, circuits and systems

Tremendous progress has been made in recent years in PIC design and manufacturing. Nonetheless, manufacturing variations and the inevitable impact on yield remains a significant challenge. Active tuning can sometimes be a solution, but the necessary system complexity and power budgets can be prohibitive. We discuss design methods to maximize yield that account for a knowledge of design variations from specific foundry processes. These methods include inverse design approaches at the component level to large scale statistical simulation of circuits using calibrated compact models.

Speaker

James Pond

Lumerical


Dr. James Pond is the CTO and co-founder of Lumerical Inc. and is a driving force behind the company’s core software algorithms, technology, and advanced photonic modeling capabilities. He has almost two decades of experience in optical and photonic simulation, and is the author of numerous papers, patents and conference presentations.

14:35
Open access integration platform: versatile solution for photonic integrated circuits
Luc Augustin, Smart Photonics
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Open access integration platform: versatile solution for photonic integrated circuits

InP based photonic components have been around for some time and have proven to be a reliable source for communication systems. InP offers the possibility to monolithically integrate high performance active and passive components. These aspects, and the introduction of generic platforms: highly standardized industrial photonic integration processes that enable realization of a broad range of applications, will lead to a dramatic reduction of the development costs of PICs which will bring them within reach for many. This talk will address the integration platform from a foundry perspective: the integration technology, the opportunities and the scale-up to large volumes.

Speaker

Luc Augustin

Smart Photonics


Luc Augustin received the M.Sc. and Ph.D. degree in Electrical Engineering from Eindhoven University of Technology, The Netherlands. After his graduation, he went to industry, to work at Cedova, and Philips Research, and later in photovoltaics at Solland Solar. He has been active in the development, pilot production and optimization of innovative technologies. He is CTO at SMART Photonics.  

14:50
Rethinking the photonics IC design flow to make high-quality PIC design easier, cheaper and faster
Ronald Broeke, BRIGHT Photonics
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Rethinking the photonics IC design flow to make high-quality PIC design easier, cheaper and faster

This presentation's abstract will be available shortly.

Speaker

Ronald Broeke

General Manager at BRIGHT Photonics


Ronald Broeke received his Ph.D. degree on photonics integrated circuits from Delft University of Technology, Netherlands. He continued his research at the University of California at Davis on applications like optical cdma and arbitrary waveform generation. After several years at ASML in project management he decided to combine his experiences and founded "PIC design house" Bright Photonics B.V.

15:05
Afternoon Refreshment Break
15:35
The Emergence of Non-Position Positioning in Fast Manufacturing Automation
Scott Jordan, Physik Instrumente
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

The Emergence of Non-Position Positioning in Fast Manufacturing Automation

Requirements have escalated for perfect relative positioning of manufactured components. Examples: In Silicon Photonics, orientation of components to extreme tolerances is needed in multiple test and assembly steps. In Smartphone camera manufacturing, more elements are assembled to tighter tolerances with each generation.   Previously this demanded exceptional dimensional control and fixturing, or painstaking positioning. But a new branch of intelligent control now provides fast, automatic, nanoscale-accurate orientation optimization in test and assembly. This improves process economics and yield by eliminating time-consuming steps and decoupling alignment from position metrology. The key is leveraging device optimization physics to reduce dependence on position commandability. A universal implementation is now commercially available and fab-proven. Process cost reductions of 99% are seen. 


Speaker

Scott Jordan

Physik Instrumente


Scott Jordan is Head of Photonics for PI. Scott is a manager and physicist by training, with an MBA in Finance and New Venture Management. He has driven multiple business development and turnaround endeavors. Scott’s patents for fast interfacing and DAC resolution enhancement helped advance nanopositioning performance more than a hundredfold, enabling capabilities for applications as diverse as nanopatterning, atomic force microscopy, MEMS, microlithography, x-ray interferometry and photonics. He developed the first digital gradient search, fundamental to photonics test and packaging, and established a successful business upon it. He has repeatedly driven the field forward as device designs have advanced. His most recent work enables one-step, global alignment optimization across multiple inputs, outputs and degrees of freedom of today’s Silicon Photonics devices. A confirmed technology evangelist, Scott publishes and presents frequently. He was named a PI Fellow in 2016.

15:50
Large scale assembly and packaging foundry for PICs
Albert Hasper, Phix
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Large scale assembly and packaging foundry for PICs

PHIX mission is to become world leader foundry in packaging and assembly of Photonic Integrated Circuits (PIC’s) by supplying PIC based components and modules in scalable production volumes. PHIX photonics assembly is a new initiative to facilitate our customers in the assembly of all packaging challenges for PICs including product design for manufacturing. The talk will highlight the roadmap from pilot line production towards HVM-production. Key is to have the right capabilities and capacities needed to serve our customers. Further, automated tools and machines are needed to address the future needs, this will also be discussed

Speaker

Albert Hasper

Phix


Albert Hasper, Ph.D. is the CEO of PHIX photonics assembly. Albert is an operational and technical executive with 25+ years of experience in international high-tech business-to-business industry. He was for 7 years the Managing Director of the Amtech Solar Companies. Before that he was the VP of Global Operations at ASM International. Prior to the VP role he served for more than 5 years as General Manager of ASM Europe and was world-wide responsible for the Vertical Furnace product line.  Albert holds a M.Sc. and Ph.D. Degree in Electrical Engineering from the University of Twente. He has authored and co-authored over 25 scientific papers in various scientific journals. He is an inventor of 13 issued US patents in the areas of CVD & ALD deposition and Capital Equipment. 


16:05
Putting the A in Design Automation
Pieter Dumon, Luceda Photonics
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Putting the A in Design Automation

Whether you’re designing a photonic IC prototype or ramping up a product, you need methodologies and tools to increase your design’s yield. In this talk, we will discuss methodologies for building high quality device models, running device and circuit level variability analysis and turning these into real tape-outs. We will show how Luceda puts the Automation in E(P)DA to enable fundamentally different workflows.

Speaker

Pieter Dumon

Luceda Photonics


Pieter obtained a PhD in electronics engineering from Ghent University in 2007, with a dissertation on optical filters in silicon photonics technology. During his PhD research, he contributed to the development of the IPKISS software. Already during his PhD he started supporting tape-ins on Imec silicon photonics technology for external customers. From 2007 to 2014, Pieter coordinated ePIXfab, the European consortium for the advancement of silicon photonics. He marketed the services presence at events around the world. He coordinated the Multi Project Wafer runs at Imec, supporting numerous world-wide designers and tape-outs, and contributed to the Imec silicon photonics platform R&D. He left Ghent University-Imec in 2014 for co-founding Luceda on the basis of years of software development and research in photonics.

16:20
Hybrid PICs - Technology Alternatives and Design Implications
André Richter, VPIphotonics
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Hybrid PICs - Technology Alternatives and Design Implications

Hybrid integrated photonics attracts growing attention, as it enables complete and cost-efficient optical chip solutions for silicon, silicon nitride, and polymer photonics in combination with III-V active optoelectronic devices. We present different practical examples of hybrid PICs, discuss associated design challenges and our approaches to their solution. We illustrate a smoothly elaborated common design workflow, which is based on standard simulation compact models and a layout-aware design approach. We demonstrate user-friendly optoelectronic circuit simulation, optimization and analysis, as well as performance verification on system-level. 


Speaker

André Richter

VPIphotonics


Dr. André Richter is an expert in the field of optical communications and related modeling and design aspects. He holds a M.Sc. degree from Georgia Tech and a Ph.D. from TU Berlin. Being member of the VPIphotonics team since 1997, André contributed numerous fundamental modeling advances in various fields. For many years he led product management, technical services and R&D activities. André serves as General Manager of VPIphotonics since 2013.

16:35
Tyndall Presentation - Title TBC
Peter O'Brien, Tyndall
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PIC Innovation − EPDA, TAP & PICs Beyond Datacom

Presentation

Tyndall Presentation - Title TBC

TBC

Speaker

Peter O'Brien

Tyndall


Dr. Peter O’Brien obtained his PhD in Physics from University College Cork in 1999. He has a Masters in Electronic Engineering and Degree in Physics from Trinity College Dublin. He was a postdoctoral scholar at the California Institute of Technology and research scientist at NASA’s Jet Propulsion Laboratory in Pasadena (Micro Devices Laboratory) where he worked on the development of millimetre wave devices for remote sensing applications. Dr O’Brien co-founded one (Biosensia) and founded a second company (Epi-Light). His second company, Epi-Light limited, developed speciality photonic systems for medical device and pharmaceutical applications. He successfully sold the company in 2009 and returned to the Tyndall National Institute to establish a research activity in advanced photonic packaging. Dr O’Brien is now head of the Photonics Packaging Group and is involved in a wide range of both academic and industry research projects, across the telecoms and medical device sectors. Dr. O’Brien is also deputy director of the Science Foundation Ireland, Irish Photonic Integration Centre

16:50
Closing Remarks by Michael Lebby
17:00
PIC Industry Awards
17:20
Networking Drinks Reception and Buffet Sponsored by Hewlett Packard Enterprise
Day 2 - Wednesday 27th March 2019
08:00
REGISTRATION - Includes Refreshments
08:50
Housekeeping by Michael Lebby
PICs Beyond 100G − Evolution and Revolution

PICs are poised to transform many end use markets as global semiconductor innovation shifts resources from electrons to photons. We’ll explore near-term opportunities and potentially disruptive, long-range advantages that PICs can offer today's service providers and end users with a focus on healthcare, autonomous driving, defense and security; artificial intelligence, AR/VR and the IoT

09:00
Where are pluggable modules going?
Martin Zirngibl, Finisar
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PICs Beyond 100G − Evolution and Revolution

Presentation

Where are pluggable modules going?

Currently all short and medium reach fiber optics communications are based on pluggable modules because they make systems easily serviceable and minimize upfront cost. However the ever increasing I/O capacity is a challenge to the pluggable model because of the power and footprint penalties that this architecture incurs. We will discuss fundamental limits and how PICs can help addressing them. We will also will review the pro and cons of co-packaged solutions where the pluggable modules are replaced by a direct optical link to the processor package.

Speaker

Martin Zirngibl

Finisar


Martin Zirngibl was named Corporate CTO in June 2018. He joined Finisar in 2016 as a VP Technology Fellow responsible for coherent product strategy. Prior to Finisar, he held progressive managerial roles at Nokia Bell Labs including Director of Optical Networking Research and Executive Director of Device and Subsystems Research. He also served as a member of technical staff at AT&T Bell Laboratories. Dr. Zirngibl holds a PhD in Physics from the Swiss Institute of Technology, Lausanne and a Diploma in Theoretical Physics from the same Institute. He received the Bell Labs Fellow award in 2008 and has published more than 100 scientific papers and filed over 50 patents.

09:15
Driving the PIC Revolution, Case Scenarios
Twan Korthorst, Synopsys
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PICs Beyond 100G − Evolution and Revolution

Presentation

Driving the PIC Revolution, Case Scenarios

Synopsys is driving the photonic integrated circuit (PIC) revolution with design automation solutions for a wide range of application requirements, from data communications to sensors and biomedical devices. Synopsys’ PIC Design Suite – which includes the OptSim Circuit and OptoDesigner tools – offers a seamless PIC design flow from concept to manufacturable design, as well as access to a single, world-class support channel.

Speaker

Twan Korthorst

Synopsys


Twan Korthorst is Director of Photonic Solutions for Synopsys. He has been active in the field of chip design and fabrication for non-traditional semiconductor micro and nano technologies for almost 25 years. He joined the PhoeniX Software team in 2007 and developed the company into a leading supplier of design solutions for photonic ICs in his role as CEO. In February 2018, Synopsys acquired PhoeniX Software, bringing together all the required software tools for PIC design and manufacture within one single organization and one single support channel. He will continue to lead the team in Enschede (The Netherlands) and advocate for photonic integration technologies around the world.

09:30
The benefits of low-barrier access to new production services for PICs today and tomorrow
Jose Pozo, EPIC
×

PICs Beyond 100G − Evolution and Revolution

Presentation

The benefits of low-barrier access to new production services for PICs today and tomorrow

The requirement for new technologies able to support faster, more efficient and less consuming devices has triggered the adoption of Photonic Integrated Circuits (PICs) for many different applications. The Pilot Lines in Photonics provide a fast service for prototyping and low-volume production of Photonic Integrated Circuits (PIC)-based products helping companies to reduce the time-to-market. The Pilot Lines, PIXAPP – for packaging and assembly PICs, MIRPHAB – for developing QCLs based chemical sensors, and PIX4LIFE – Si3N4 PICs for life sciences cover a wide range of applications from telecom to healthcare, including environmental monitoring and industrial sensing.

Speaker

Jose Pozo

EPIC


Dr. Jose Pozo is Director of Technology and Innovation at EPIC (European Photonics Industry Consortium). As EPIC’s CTO, he represents 385 leading corporate members active in the field of Photonics. His job consists on actively engaging with them and provide them with tools to strengthen their position in the supply chain. He has 20 years’ background in photonics technology, market knowledge, and a large network within the industrial and academic photonics landscape. Dr. Pozo holds a Ph.D. in electrical engineering from the University of Bristol, U.K., and a M.Sc. and B.Eng. in telecom engineering from Spain/Belgium.

09:45
Photonic Integration Opportunities for Next-Generation Coherent High-Capacity Systems
Martin Guy, Ciena Corporation
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PICs Beyond 100G − Evolution and Revolution

Presentation

Photonic Integration Opportunities for Next-Generation Coherent High-Capacity Systems

Next-generation high-capacity optical coherent transmission systems at 400G and above will demand different set of requirements depending on the target applications. Long haul and ultra-long haul systems such as submarine and inter-continental links will have to be optimized for fiber capacity and reach. Shorter-reach applications such as metro, DCI and 5G access links will need low power and high density pluggable modules. From an optical components perspective, the right combination of photonic integration technologies will be mandatory to address all the stringent requirements related to bandwidth, size, power and cost. In this presentation, we will review the opportunities associated with InP and Silicon Photonics optical material platforms and photonic packaging technologies to address the challenges of next-generation high-capacity optical coherent transmission systems.

Speaker

Martin Guy

Chief Technology Officer & Strategic Marketing at Ciena Corporation


From 1996 to 2000, Mr. Guy worked at INO (Institut National d’Optique) as Head of Technology for the Optical Communications Group. In April 2000, he co-founded TeraXion and acted as V-P Product Management and CTO of the company. Since 2016, he is Senior Director at Ciena and leads the activities related to the developments of high-speed photonic integrated components. Mr. Guy holds a Ph.D. degree in Electrical Engineering from Université Laval in Québec City and has worked in the field of photonics for more than 25 years.

10:00
The critical role that EC support for photonics and PIC devices plays in our manufacturing future.
John Magan, European Commission Photonics Unit
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PICs Beyond 100G − Evolution and Revolution

Presentation

The critical role that EC support for photonics and PIC devices plays in our manufacturing future.

Recognising the importance of photonics and PICs, the EU’s ICT research programme has worked with the photonics industry and research community to run a series of actions to build up a technology base in Europe, particularly in PIC manufacturing. This presentation will review these actions, consider the lessons learned, and look to further opportunities for support and the next research programme beyond 2020: Horizon Europe.

Speaker

John Magan

European Commission Photonics Unit


John Magan received a Ph.D. in laser physics from Trinity College Dublin in 1989. After working for Hoechst AG in Germany from 1989 to 1992, where he was responsible for setting up an industrial laser lab, he joined the European Commission where he has worked in research funding in the Community’s Information and Communication Technologies programmes. He is currently deputy head of the photonics unit. 

10:15
3D laser written glass components for advanced photonic integration
Nick Psaila, Optoscribe
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PICs Beyond 100G − Evolution and Revolution

Presentation

3D laser written glass components for advanced photonic integration

The persistent drive for increased bandwidth and density while simultaneously reducing cost in datacenter optical communication systems is placing substantial pressures on component manufacturers to increase the level of integration and adopt more efficient and lower cost assembly processes.

Ultrafast lasers offer a unique tool for the integration of photonic components in this application. The talk will show how this can be used for manufacturing glass-based interconnect components, which are applied to both fiber-fiber and fiber-transceiver applications. The talk will show how these components can be used as optical interfaces or further combined with conventional processes to help solve challenges in the packaging of photonic components. In addition to this the talk will also show how these components can be used as integration platforms for optical sub-assemblies and photonic-electronic interposers.


Speaker

Nick Psaila

Optoscribe


Nick Psaila is co-founder and CEO of Optoscribe Ltd. He is an expert in the manufacturing and use of photonic technologies in optical communications, with a particular focus on laser based manufacturing techniques. He is responsible for both strategic and technical facets of the business and has led the company from its formation. Nick has a PhD in Photonics from Heriot Watt University, an MSc in Photonics and Optoelectronic Devices from St Andrews University and BSc in Physics from Imperial College London. In 2010, he was awarded an Enterprise Fellowship from the Royal Society of Edinburgh. He has co-authored more than 60 publications and several patents in the field of laser based manufacturing. 


10:30
Integrated Silicon Photonics for future Datacenter Applications
Thomas Liljeberg, Intel
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PICs Beyond 100G − Evolution and Revolution

Presentation

Integrated Silicon Photonics for future Datacenter Applications

The rapid growth in data center traffic is driving accelerating requirement to the bandwidth and performance of networking equipment, including optical interfaces and Ethernet switches. Looking ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. We will review motivation for integration and the enabling technology elements, and discuss how co-packaged Silicon Photonics enables higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.

Speaker

Thomas Liljeberg

Intel


Thomas Liljeberg is Sr. Director of Product Line Management in the Silicon Photonics Products Division at Intel Corporation, where he is responsible for the photonic integration programs and products. From 2004 to 2015, he was at Source Photonics serving in various roles of increasing scope and responsibility in Product Management and R&D, most recently as Executive VP of Product Line Management. Prior to Source Photonics, Thomas Liljeberg was with Agility Communications from 2000 to 2004. He holds a Ph.D. degree in Electrical Engineering from University of California, Santa Barbara, and a M.S. from Technical University of Denmark 

10:45
Morning Refreshment Break
PIC ROI − Show Me the Money

While manufacturers are working to automate PIC assembly, packaging and test, we will examine how existing and future sector investments will reap dividends. What cycles should investors anticipate? How can financiers accurately gauge product potential within emerging PIC sectors?

11:15
Coherent DWDM router interfaces: Opportunities for photonic integration
Dirk Van Den Borne, Juniper
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PIC ROI − Show Me the Money

Presentation

Coherent DWDM router interfaces: Opportunities for photonic integration

Small form factor 400G digital coherent optical (DCO) modules are the most exiting technology development in DWDM transport since the introduction of coherent detection a decade ago. In this talk, we will focus on this new class of pluggable DCO modules from a system vendor perspective and discuss the different applications that they are expected to address. In particular, we will detail the advantages and challenges involved in using pluggable DCO modules in dense routing and switching platforms. Finally, we will consider how further optical integration and DSP development can enable an even broader use of pluggable DCO modules. 

Speaker

Dirk Van Den Borne

Juniper

11:30
Assessing the long-term growth and market potential for PIC devices in datacom, transport and networks
Eric Higham, Strategy Analytics
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PIC ROI − Show Me the Money

Presentation

Assessing the long-term growth and market potential for PIC devices in datacom, transport and networks

Historically, growth of optical markets was sinusoidal; periods of sharp contraction followed times of booming expansion in a repeating pattern. While the past was not for the faint of heart, recent performance shows that the optical market has gotten far less volatile, with a strong upward growth trajectory. This presentation will explore the shift in drivers for optical market growth and the trends for the future. It will also address the advantages and disadvantages of Photonic Integrated Circuits (PIC), their most likely applications and the use of compound semiconductor technologies in PICs, as well as the broader optical market.

Speaker

Eric Higham

Strategy Analytics


As Director for the GaAs & Compound Semiconductor Technologies Service, Eric Higham provides analysis of the dynamics and trends for processes, technologies and components in wired and wireless communications markets. His areas of research include 3G and emerging 4G wireless networks, fiber optic networks, CATV, millimeter wave communications, broadband, military radar, EW and communications applications. Prior to joining Strategy Analytics, Eric worked in a variety of engineering, business development and marketing roles for Raytheon, Micro-Dynamics and M/A-COM. In these positions, he participated in the emergence and growth of the commercial wireless industry. Eric was most recently President and founder of Spectrum Business Development, where he developed market and product research for a variety of market applications. After over three decades in the semiconductor field, he brings a deep understanding of the technical and market trends in the GaAs and compound semiconductor sector. Eric holds an MSEE degree from Northeastern University in Boston, MA and a BSEE degree from Cornell University in Ithaca, NY.

11:45
Panel Session Will PICs be the engine of growth over the next decade? Is the growth supported in our roadmaps world-wide?
Michael Lebby, Michael Liehr, Werner Steinhögl, Takahiro Nakamura, Wyn Meredith
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Panel Session

Will PICs be the engine of growth over the next decade? Is the growth supported in our roadmaps world-wide?

The increasing demand for higher speed data transmission has ramifications across all network operations. Mobile operators expect 5G to meet customer demands with data rates up to 1 G/bps. The demands for fiber networks – the backbone of high capacity data conveyance – are far greater. As PICs move into 100G data center slots, the push for ever-faster, higher bandwidth intra- and inter-center communications continues. At the same time, photonic integrated circuits are relatively new technology, with automated TAP far behind state-of-the-art microelectronics manufacturing. Can PICs support advanced datacom and long-distance telecom applications as reflected in our global technology roadmaps?

Speakers

Michael Lebby

Lightwave Logic

Michael Liehr

American Institute for Manufacturing Photonics

Werner Steinhögl

European Commission Photonics Unit

Takahiro Nakamura

PETRA

Wyn Meredith

IQE

12:15
Lunch Break
PICs Reimagined − Hybrids and Materials Innovation

PIC innovation is already linked to hybrids − InP lasers are driven by silicon chips and die-level devices are combined into modules. While silicon photonic (SiP) optimization continues we will concurrently explore the benefits of bringing compound semiconductor technologies such as GaAs, GaN, lithium niobate, and silicon carbide into PIC development programs

13:15
Additive manufacturing by two-photon-polymerization for photonic integration
Jochen Zimmer, Nanoscribe
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

Additive manufacturing by two-photon-polymerization for photonic integration

Two-photon-polymerization can be used for the direct printing of complex micro- and mesoscale 3D parts. These parts can be transparent, have optical-quality surfaces, and be printed on pre-structured surfaces such as PICs. Each part can be printed with parameters optimized for the individual assembly it is printed on. Thus, this technology offers an interesting way to integrate components from different sources.

Speaker

Jochen Zimmer

Nanoscribe


Dr. Jochen Zimmer finished his doctorate on the subject of superconducting nanostructures at Karlsruhe Institute of Technology in 2013. Since then, he worked in the 3D printing industry (INDMATEC GmbH, Stratasys GmbH/MakerBot Division) and is with Nanoscribe GmbH since 2017.

13:30
Vertical integration in SiN based foundry enables new applications
Arne Leinse, LioniX International
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

Vertical integration in SiN based foundry enables new applications

The integration of Photonic Integrated Circuits (PICs) in functional modules enables endusers to use PICs in a variety of applications. Due to the hybrid integration of multiple platforms in a single module a variety of new applications can be addressed. For the silicon nitride based TriPleX platform these range from 5G to virtual reality and sensing. The main benefit is in the low loss properties over a large wavelength range enabling these different applications. In this talk we will show the capabilities of these modules and the necessity for vertical integration. It is all about module functionality and not about PICs.

Speaker

Arne Leinse

Chief Commercial Officer at LioniX International


Arne Leinse Ph.D (Chief Commercial Officer) is active in integrated optics for more than 15 years. He received a PhD degree from the University of Twente in the integrated Optical Microsystems group in 2005. Hereafter he joined LioniX BV where he was involved in the invention and development of the TriPleX™ platform from the beginning. He has been involved from the original concept until the exploitation and (co)authored over 100 articles in the last years. He has been active as Vice-President of LioniX BV in the last years and since the establishment of LioniX-international in 2016 active in the role of Chief Commercial Officer.

13:45
Polymer PIC opportunities in Applications Beyond 100G
Michael Lebby, Lightwave Logic
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

Polymer PIC opportunities in Applications Beyond 100G

This presentation's abstract will be available shortly.

Speaker

Michael Lebby

Lightwave Logic


Presently, Michael is driving new frontiers in the integrated photonics field as: CEO and Board Director, Lightwave Logic Inc. Michael is also part-time full Professor and Chair of optoelectronics at Glyndwr University in Wales, UK where he contributes to the European Commission’s programs and pilot lines in integrated photonics. Michael has been involved in photonics for his whole career which began with research for the UK Government R&D labs in 1977, and continued at AT&T Bell Labs in 1984. At that time, Michael’s activities included researching novel optoelectronic devices in III-V compound semiconductors. Michael then went to Motorola’s Corporate R&D labs in 1989 and drove the VCSEL based technology platform to product and high volume manufacturing. He continued his fiber optics roles at AMP/TE Connectivity, and then helped initiate Intel’s silicon photonics work in 1999. In 2001, he founded his own company Ignis Optics to develop OC-48/192 transceivers and subsequently sold the company to Bookham (now Oclaro). Michael then led OIDA (Optoelectronics Industry Development Association) in Washington DC to campaign on behalf of the photonics industry. At OIDA Michael coined the term ‘green photonics’ and established this as discipline in the industry. Michael also spoke on Capitol Hill representing the optoelectronics industry. Since 2010, Michael has been focusing on bringing PIC (Photonic Integrated Circuit) based technologies to market in various roles that include Solar, LED lighting, and Integrated Photonics for fiber communications. Michael is pursuing high speed polymer based integrated photonics as part of a polymer PIC platform at Lightwave Logic Inc.

14:00
New advances in Silicon Nitride (siN) PIC Applications
Michael Geiselmann, LIGENTEC
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

New advances in Silicon Nitride (siN) PIC Applications

Silicon nitride photonic integrated circuits offer new possibilities for existing and emerging applications. Application such as Beamforming, Augmented Reality, Quantum and nonlinear integrated photonics and Bio-sensing benefit from a transparency window from the visible to the Mid-Infrared and the ultra-low losses in those wavelength ranges.

LIGENTEC's fabrication process is based on the all-nitride-core technology and designed from the bottom up for photonics and modularity. In the all-nitride-core, most of the optical mode energy is in the waveguide material, which reduces loss and makes small bending radii possible. Latest developments on further integration of active elements and modules are presented.


Speaker

Michael Geiselmann

Co-Founder at LIGENTEC


Michael Geiselmann studied physics and engineering at University Stuttgart and Ecole Centrale Paris. After his PhD at the Institute of Photonic Sciences (ICFO) in Barcelona in 2014 he joined the laboratory of Prof. Kippenberg at EPFL, where he advanced frequency comb generation on integrated silicon nitride chips towards applications and was involved in several international research projects. In 2016, he co-founded LIGENTEC. At LIGENTEC he is advancing the technology development of silicon nitride based integrated circuits and is looking for new business opportunities. He is responsible for technical sales and brought LIGENTEC to the ESA Business Incubator Switzerland program and several other European and transatlantic projects.

14:15
Optical passive device platform to enhance photonics performances
Arnaud Rigny, Teem Photonics
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

Optical passive device platform to enhance photonics performances

One optical component integration challenge is to bring together active and passive functions with very different technical constraints. Compromise is often hard to come on single technology platform making multi-platform solutions attractive.  The glass platform is a solution of choice to make the optical link between source and fiber by integrating low-loss, temperature-stable passive interface solutions. Teem photonics, expert in ion exchange technology on glass ( IoNext ) , is developing an innovative solution providing a unique low-loss collective coupling technology integrating passive functions (taps, splitter, multiplexer, ... ), compatible with most of active photonic integration platforms (SiPh, PIC, SiN ...)  


Speaker

Arnaud Rigny

Teem Photonics


Arnaud Rigny is responsible of the sales and business development activities for Teem Photonics. He has more than 20 years of experience in the fields of photonics and semiconductor. After a 10-year experience in research and development at Corning then in product line management at Alcatel Optronics, he joined Soitec as a manager of research and development projects before taking on commercial responsibilities in 2007. He graduated from the Télécom ParisTech engineering school and has a doctorate in optoelectronics from Télécom ParisTech.

14:30
Presentation TBC - HPE
Di Liang, Hewlett Packard Enterprise
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

Presentation TBC - HPE

This presentation's abstract will be available shortly.

Speaker

Di Liang

Research Scientist at Hewlett Packard Enterprise


Di Liang is currently a research scientist at Hewlett-Packard. His research interests include III-V and silicon photonics, hybrid integration, and nanofabrication technology. He has authored and coauthored over 130 journal and conference papers, three book chapters, and was granted by three US/international patents with another 35 pending.

14:45
III-V Lasers directly grown on Silicon
Kei May Lau, Hong Kong University of Science & Technology
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

III-V Lasers directly grown on Silicon

To support an energy-efficient optical interconnect technology enabled by silicon photonics, development of low-power-consumption active devices and associated integration technologies is needed. Most communication wavelength lasers with excellent device performance have been grown on III-V substrates and bonded to silicon. For monolithic integration, growth and fabrication of such lasers on III-V/ Si compliant substrates is another option. QDs grown on compliant III-V/Si substrates and laser characteristics of whispering-gallery-mode (WGM) micro-lasers, and conventional Fabry Perot lasers will be discussed. Another approach involves nano-ridge lasers with embedded quantum wells grown on stripe patterned on-axis Si substrates or SOI. Room temperature lasing inside nano-cavities at telecom bands is challenging and has only been demonstrated up to the E band. We have achieved InP/InGaAs nano-ridge lasers resulting in emission wavelengths ranging from the O-, E-, S- to C-band operating at room temperature with ultra-low lasing thresholds. These energy-efficient micro-lasers are excellent candidates for on-chip integration with silicon photonics.

Speaker

Kei May Lau

Hong Kong University of Science & Technology


Professor Kei May Lau is the Fang Professor of Engineering at the Hong Kong University of Science and Technology (HKUST). She received the B.S. and M.S. degrees in physics from the University of Minnesota, Minneapolis, and the Ph.D. degree in Electrical Engineering from Rice University, Houston, Texas. She was on the ECE faculty at the University of Massachusetts/Amherst and initiated MOCVD, compound semiconductor materials and devices programs. Since the fall of 2000, she has been with the ECE Department at HKUST. She established the Photonics Technology Center for R&D effort in III-V materials, optoelectronic, high power, and high-speed devices. Professor Lau is a Fellow of the IEEE (2001), a recipient of the US National Science Foundation (NSF) Faculty Awards for Women (FAW) Scientists and Engineers (1991), Croucher Senior Research Fellowship (2008), and the IEEE Photonics Society Aron Kressel Award (2017). She is an Editor of the IEEE EDL and former Associate Editor of IEEE TED, Applied Physics Letters and Journal of Crystal Growth.

15:00
Presentation Title TBC
Ruth Houbertz, Multiphoton Optics
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PICs Reimagined − Hybrids and Materials Innovation

Presentation

Presentation Title TBC

This presentation's abstract will be available shortly.

Speaker

Ruth Houbertz

Multiphoton Optics


Cofounder of Multiphoton Optics GmbH, founded in September 2013. Current function as CEO from August 2014. From 2013 to July 2014, she was CTO of MPO. From 2000 to 2012, she held different technical and management positions at Fraunhofer ISC, where she focussed on materials, processes, and technology/equipment development for photonic and biomedical applications. From 1999 to 2000, she worked at Sandia Nat.’l Labs, Livermore, CA (USA). She invented more than 90 patents and has received many awards and nominations, amongst which are the Finalist in the Prism Award 2017 and 2015, the Cowin Award for Entrepreneurship 2014, the Green Photonics Award 2013, the Joseph von Fraunhofer Award 2007.

15:15
Closing Remarks by Michael Lebby

Please Note: PIC International reserves the right to make any necessary changes to this agenda. Every effort will be made to keep presentations and speakers as represented. However, unforeseen circumstances may result in the substitution of a presentation topic or speaker. PIC International reserves the right to use photographs of any attendee for future promotions.

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